Wafer Sorter & AOI-Wafer Sorter & AOI

 SPECIFICATION
silicon wafer 8 inch & 12 inch
Pick and place method Robot type pick and place film
Fragmentation method

1. According to AOI to determine the level

2. Segment by ID

3. Direct sharding
OCR Area CCD reading (front)
RFID

Match customer needs/format

Optional
SECS For customer needs/format connection

Relate SEMICONDUCTOR EQUIPMENT Series

SEMICONDUCTOR EQUIPMENT:Wafer thickness measurement-Wafer thickness measurement
Wafer thickness measurement

Model: Wafer thickness measurement

SEMICONDUCTOR EQUIPMENT:Wafer Sorter & AOI-Wafer Sorter & AOI
Wafer Sorter & AOI

Model: Wafer Sorter & AOI

SEMICONDUCTOR EQUIPMENT:Wire Bond AOI-Wire Bond AOI
Wire Bond AOI

Model: Wire Bond AOI

We accept orders of special machine sizes .