SPECIFICATION | |
silicon wafer | 8 inch & 12 inch |
Pick and place method | Robot type pick and place film |
Fragmentation method | 1. According to AOI to determine the level 2. Segment by ID 3. Direct sharding |
OCR | Area CCD reading (front) |
RFID | Match customer needs/format Optional |
SECS | For customer needs/format connection |